SiC/Si Wafer Grinding Solution

SiC/Si Wafer Grinding Solution

SiC chips are made from 4H single-crystal Silicon Carbide. They have many outstanding properties, including high-efficiency power conversion and the ability to handle high voltage and high power applications. This gives them significant advantages in high-temperature and high-pressure environments, such as in electric vehicles, 5G and satellite communications, and industrial applications.

SiC∕Si wafer grinding wheels

SiC∕Si wafer grinding wheels

SiC wafers are thinned through processes such as grinding, lapping, and chemical mechanical polishing (CMP) to achieve specific thicknesses (<200um／350um／500um) for different applications. This thinning improves thermal dissipation, reduces the weight of the chip module, and enhances chip performance, thereby meeting various application needs.

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