Component : Slide rail/Slider
Material : Stainless steel SUS440
Grinding Type : Surface Grinding
Grinding wheel : EB series 1A 405*50*127​

Advancements in continuous grinding technology have led to a high degree of automation and digitization in gear manufacturing, profoundly impacting the gear manufacturing process and directly enhancing the efficiency and reliability of mechanical transmission systems.

SiC wafers are thinned through processes such as grinding, lapping, and chemical mechanical polishing (CMP) to achieve specific thicknesses (<200um／350um／500um) for different applications. This thinning improves thermal dissipation, reduces the weight of the chip module, and enhances chip performance, thereby meeting various application needs.